Taiwan-based company, MediaTek has unveiled a new chipset in the Dimensity series chipset, called MediaTek Dimensity 7200.
The newly announced chipset is a mid-range offering from the company and comes with a focus on gaming and photography, two of the most sought-after features by users.
The MediaTek Dimensity 7200 SoC is built by Taiwan Semiconductor Manufacturing Company (TSMC) using the N4P process, which is the same used in the Dimensity 9200 series as an improvement over the Dimensity 9000.
It features two Cortex-A715 cores with a high frequency of 2.8GHz and six Cortex-A510 cores. There’s also Mali G610 MC4 GPU for handling visuals on the device. It supports a Full HD display of up to 144Hz along with HDR10+, CUVA HDR, and Dolby HDR.
There’s MediaTek HyperEngine 5.0, which allows for AI-based Variable Rate Shading and has UFS 3.1 storage for faster loading and RAM running at up to 6,400Mbps (LPDDR5). For optics, the chipset uses a 14-bit HDR ISP with support for 4K HDR video capture and also supports a main camera of up to 200MP and is capable of taking in two video streams of Full HD resolution each.
It also has APU, allowing for a number of AI-powered camera enhancements, such as Real-Time Portrait Beautification. The chipset also supports 5G sub-6GHz with up to 4.7Gbps downlink, along with 2CC Carrier Aggregation, Dual SIM 5G, triband Wi-Fi 6E, and Bluetooth 5.3.
MediaTek Dimensity 7200 vs Dimensity 8200 specifications
| Dimensity 7200 | Dimensity 8200 | |
| Process | TSMC N4 (4nm-class) | |
| CPU | 2x Cortex-A715 @ 2.8GHz 6 x Cortex-A510 | 1x Cortex-A78 @ 3.1GHz 3x Cortex-A78 @ 3.0GHz 4x Cortex-A55 @ 2GHz |
| Memory | Quad-channel LPDDR5 6400Mbps, LPDDR4x, dual-channel UFS 3.1 | |
| Camera | Imagiq 765 ISP, 200MP, 14-bit ISP, Video HDR Video EIS Dual simultaneous video capture AI-2A (AI-AF, AI-AWB) All-pixel AF | Imagiq 785 ISP, 320MP, 32+32+32MP, Simultaneous dual camera HDR video recording, 5Gbps 14-bit HDR-ISPs / Video HDR / Video Bokeh / Video EIS / AI-Shutter / AI-AE / AI-AF / AI-AWB / AI-NR HDR / AI-HDR / AI-FD |
| Display | Full HD+ @ 144Hz HDR | FHD+ @ 180Hz / WQHD+ @ 120Hz |
| Video Playback / Video Encode | H.264, HEVC, VP-9, AV1 / H.264, HEVC, 4K60 HDR10+ | |
| Graphics | Arm Mali-G610 MC4 | Arm Mali-G610 MC6 |
| APU | MediaTek 5th generation APU APU 650 | MediaTek 5th generation APU APU 580 (multi-core) |
| Modem | 2G-5G Multi-Mode, 5G/4G CA, 5G/4G FDD / TDD, CDMA2000 1x/EVDO Rev. A (SRLTE), EDGE, GSM, TD-SCDMA, WDCDMA SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD and FDD bands, DSS, NR DL 2CC 200MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, R16 UL Enhancement, 2×2 MIMO, 256QAM VoNR / EPS fallback | |
| Connectivity | Integrated Wi-Fi 6E (a/b/g/n/ac/ax) 2T2R, Bluetooth 5.3, GPS, BeiDou, Glonass, Galileo, QZSS, NavIC | |
Availability
The Dimensity 7200 will power 5G devices launching in the global market in Q1 2023. Based on earlier rumours, vivo V27 that is launching soon will be one of the first devices with the chip.
