Google is expected to unveil the Pixel 8 series later this year. Now the specifications of the Tensor G3 that will power the phones have surfaced, thanks to Android Authority. The Tensor G3 is said to use a new 1+4+4 setup, compared to 2+2+4 in the Tensor G2 and feature ARMv9 cores.

Google new Tensor processor

This is said to include 1 x Cortex-X3 prime core clocked at 3.0GHz, 4x Cortex-A715 performance cores clocked at 2.45GHz and 4 x Cortex-A510 power efficient cores clocked at 2.15GHz. All the cores have seen a boost in clock speed.

The Tensor G3 is said to feature a Mali-G715 (Immortalis) 10-Core GPU clocked at 890MHz and will feature ray-tracing support. The chip is also said to support AV1 encode capabilities, making it the first to smartphone chip to support the codec.

The chip is said to get a new TPU — codename “Rio” clocked at 1.1GHz and second-generation GXP. It will also support UFS 4.0 storage, compared to UFS 3.1, but retain Exynos Modem 5300 from the Tensor G2.

Google Tensor 3 Specifications

  • Layout: 4x Cortex-A510 @ 2.15GHz + 4x Cortex-A715 @ 2.45GHz + 1x Cortex-X3 @ 3.0GHz.
  • ARMv9 architecture
  • Support for Memory Tagging Extensions ( (MTE) by Arm.
  • GPU: Arm Mali-G715, 890MHz. Presumably a 10 core ‘Immortalis’ variant with ray tracing support.
  • Potential support for 8K30 video decoding/encoding in H.264 and HEVC. But this is unlikely to be included in the final device.
  • The Pixel 8 will be the first phone to support AV1 to 4K30 encoding.
  • The TPU, codenamed ‘Rio’, will run at 1.1GHz.
  • A new second-generation GXP digital signal processor (codenamed ‘callisto’) with a frequency increase from 975MHz to 1065MHz.
  • New UFS 4.0 controller from Samsung.
  • Modem: A ‘slightly different variant’ of the Exynos Modem 5300.



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