Mediatek unveils Dimensity 930 and Helio G99

Alongside the unveiling of the Dimensity 1050, which is MediaTek‘s first mmWave 5G chipset for next generation of 5G smartphones, the company also launched the Dimensity 930, and Helio G99.

Mediatek Dimensity 930

Table of Interests

Mediatek Dimensity 930

The company also introduced the Dimensity 930 which actually has Cortex-A78 cores clocked at 2.2GHz, less than Dimensity 900 and 920, but this has new IMG BMX-8-256 GPU.

MediaTek Dimensity 930 vs 920 vs 900 specifications

Processor Dimensity 930 Dimensity 920 Dimensity 900
Process 6nm TSMC
CPU 2x Cortex-A78 @ 2.2GHz
6x Cortex-A55 @ 2GHz
2x Cortex-A78 @ 2.5GHz
6x Cortex-A55 @ 2GHz
2x Cortex-A78 @ 2.4GHz
6x Cortex-A55 @ 2GHz
Memory LPDDR4x, LPDDR5, UFS 2.1,UFS 2.2, UFS 3.1
Camera 64MP, 108MP, Hardware video HDR, 3X HDR-ISP, MFNR, 3DNR, AINR, Hardware Depth Engine, Warping Engine 20MP+20MP, 108MP, Hardware video HDR, 3X HDR-ISP, MFNR, 3DNR, AINR, Hardware Depth Engine, Warping Engine
Display 2520 x 1080 (Full HD+) at 21:9 120Hz
Video Playback / Video Encode H.264, H.265 / HEVC, VP-9, AV1 / H.264, H.265 / HEVC
Graphics IMG BXM-8-256 Mali-G68 MC4
Modem True Dual 5G SIM (5G SA + 5G SA) modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD Band, NR FDD Band, DSS, NR DL 2CC, 200 MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, 2×2 MIMO, 256QAM VoNR / EPS fallback
Connectivity Integrated Wi-Fi 6 (a/b/g/n/ac/ax), Bluetooth 5.2, GPS L1CA+L5 / BeiDou B1I+ B2a / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC

Smartphones powered Dimensity 930 are expected in the second quarter of 2022.

MediaTek Helio G99

The Helio G99 is a 4G chip which promise more than 30% power savings for gaming compared to the Helio G96 since this uses SMC N6 (6nm-class) chip production process compared to 12nm. It also has slightly higher clock speeds.

Processor  Helio G99  Helio G96
Process TSMC 6nm TSMC 12nm
CPU 2x Cortex-A76 @ 2.2GHz
6x Cortex-A55 @ 2GHz
2x Cortex-A76 @ 2.05GHz
6x Cortex-A55
Memory 2X LPDDR4x Up to 2133MHz, eMMC 5.1 / UFS 2.2
Camera 16MP+16MP, 108MP, 32MP @ 30fps ZSL; 16MP + 16MP @ 30fps3X ISP; AI Face Detection; HW depth engine; AINR; Single-Cam/Dual-Cam Bokeh; Hardware Warping Engine (EIS); Rolling Shutter Compensation (RSC) engine; MEMA 3DNR; Multi-Frame Noise reduction; 26MP+16MP, 108MP, 32MP @ 30fps ZSL; 16MP + 16MP @ 30fps ZSL;
3X ISP; AI Face Detection; HW depth engine; AINR; Single-Cam/Dual-Cam Bokeh; Hardware Warping Engine (EIS); Rolling Shutter Compensation (RSC) engine; MEMA 3DNR; Multi-Frame Noise reduction
Display 2520 x 1080 (Full HD+) at 21:9 120Hz
Video Decode / Video Encode 2160p (2160 x 1080), h.264, h.265 / HEVC 4K 30fps, FHD 120fps, HD 240fps
Graphics Arm Mali-G57 MC2
Modem Cat-13 DL, 4G Carrier Aggregation (CA), CDMA2000 1x/EVDO Rev. A (SRLTE), 4G FDD / TDD, HSPA +, 4X4 MIMO, 2CC CA, 256QAM, TAS 2.0, HPUE, IMS (VoLTE\ViLTE\WoWi-Fi), eMBMS, Dual 4G VoLTE (DSDS), Band 71
Connectivity Integrated Dual-Band Wi-Fi 5 (a/b/g/n/ac), Bluetooth 5.2, GPS / QZSS L1+ L5 / Galileo E1 + E5a / BeiDou B1C + B2a / NAVIC

Availability

Smartphones powered by the Dimensity 930 are expected during this second quarter of 2022 and smartphones with Dimensity 1050 and the Helio G99 are expected in the third quarter of 2022.

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