More Details Of MediaTek Dimensity 7000 Emerges
After years of struggling as an underdog, MediaTek is finally gaining grounds. The company recently overtook Qualcomm to become the largest manufacturer of mobile chips from Qualcomm and recently announced a performance monster – Dimensity 9000. It remains only to understand how good this chip will be against the Snapdragon 8 Gen1 and Exynos 2200 with AMD graphics.
MediaTek intends to compete also in the segment of sub-flagship chips. The company is preparing to release the Dimensity 7000, which should surpass the Snapdragon 870 in terms of performance. The chipmaker has scheduled a press event in China for December 16; and they say that they will arrange a local announcement of the Dimensity 9000 and may introduce the Dimensity 7000.
The well-known network insider Digital Chat Station is among those who talked about MediaTek’s plans to release a competitor to Snapdragon 870, and he has now slightly opened the veil of secrecy over the characteristics of the processor.
According to him, the Dimensity 7000 will be manufactured using a 5-nanometer process from TSMC; and will receive two clusters of cores: four Cortex-A78 cores with a peak frequency of 2.75 GHz; and a quartet of energy-efficient Cortex-A55 cores operating at a frequency of 2.0 GHz. The graphics subsystem Mali-G510 MC6 will be responsible for graphics processing.