Taiwan Semiconductor Manufacturing Company (TSMC), according to some Taiwan media, has started the mass production of Qualcomm Snapdragon 875 processors. When launched, the SoC will become the heart of the flagship smartphones in 2021.
Snapdragon 875 Specs and Feature
Snapdragon 875 provides 5-nanometer manufacturing technology. Compared to the current 7nm Snapdragon 865 chips, the new processor will be able to demonstrate improved performance while lowering power consumption.
According to the available data, the Snapdragon 875 processor will receive eight cores in the configuration 1 + 3 + 4. In particular, there will be one super-core Cortex-X1, providing a 30 percent increase in peak performance compared to the current Cortex-A77.
The SoC has a Snapdragon X60 5G modem with a data transfer rate of up to 7.5 Gb/s. Finally, the chip will include the high-performance Adreno 660 graphic processing unit.
Qualcomm is reported to start receiving Snapdragon 875 processors from TSMC by the end of the third quarter â€“ in September. The official presentation of the new chip will be held at the end of this year. The first smartphones based on the Snapdragon 875 SoC platform will appear on the market in the first quarter of next year.