Redmi Note 8 Pro official teardown reveals a heat pipe for the Helio G90T chipset

The Redmi Note 8 Pro is the first phone to feature a 64MP camera, iand not that alone, it’s the first quad camera phone by Xiaomi. Aside that – it’s also the first phone to use MediaTek’s gaming-focused Helio G90T chipset. Now, we have a close look to all those components, thanks to official teardown images.

The G90T chipset isn’t left to work off its gloves, it has a copper heat pipe that connects it to the aluminum chassis of the phone to spread out the heat. You can also see the LPDDR4x RAM stacked on top of the UFS 2.1 storage.

There are a few more MediaTek chipsets here, but charging is handled by a Qualcomm chip that enables QuickCharge 4.0+. The chipset itself supports MediaTek’s PumpExpress 4.0. Both of QC4.0+ and PE4.0 are compatible with USB Power Delivery to boot.

The 64MP camera module is tagged with the 2MP depth sensor while the 8MP ultra wide cam and the macro cam are separate units. An extra detail here is that the glass cover for the quad camera where the fingerprint reader is located.

Now, taking another look at the second image on the first row, you’ll see the antenna placement. There are two 2G/3G/4G antennas, one on top and one on the bottom, then there are a couple of Wi-Fi antennas. Of interest are the four corners (in green), which are there to reinforce the phone in case of a drop.

Redmi Note 8 Pro teardown shows a heat pipe for the Helio G90T chipset


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