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Qualcomm has announced chipsets for entry-level smartphones and which in turns brings a mid-ranger performance to them. The chipsets includes Snapdragon 632, Snapdragon 439, and Snapdragon 429. They promise increased CPU and graphics performance as well as improved power efficiency. They are expected tohave AI capabilities and support for various mobile payment systems.

The best part of the announcement is that the Snapdragon 632, which is built on the 14 nm FinFET process, while the two 400-series platforms will be on the 12 nm wafer. Kedar Kondap, Product Manager and VP at Qualcomm, said that over 1,350 devices run the 600-tier platforms and 2,300 more are on the 400-series. The three new processors will bring significant improvements and enhanced features to OEMs and users, Kondap added.

Snapdragon 632 Snapdragon 439 Snapdragon 429
Process 14 nm (FinFET) 12 nm (FinFET) 12 nm (FinFET)
CPU 8x Kryo 250 (1.8 GHz) 8x Cortex-A53 (1.95 GHz) 4x Cortex-A53 (1.95 GHz)
GPU Adreno 506 Adreno 505 Adreno 504
Camera Up to 24MP / 13MP + 13 MP Up to 21MP / 8MP + 8MP Up to 16MP / 8MP + 8MP
Video 4K @ 30fps / 1080p @ 60fps 1080p @ 30fps 1080p @ 30fps
Max screen res Full HD+ Full HD+ HD+
LTE 300Mbps / 100Mbps 150Mbps / 75Mbps 150Mbps / 75Mbps
Wi-Fi 802.11ac (364Mbps) 802.11ac (364Mbps) 802.11ac (364Mbps)
QuickCharge N/A 3 3

Snapdragon 632, 439, and 429 are software compatible with the 626, 625, and 450. The 439 and 429 are even pin-compatible for quick upgrades should manufacturers decide to go that way.

Qualcomm promises devices with the new SoC will start to appear in the H2 2018, so I expect an even more diverse chipset landscape by the end of the year.

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